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U.S. firms partner with Odisha on semiconductor manufacturing initiative
Ambassador Vinay Mohan Kwatra described the project as an important milestone in advancing the vision articulated by Prime Minister Narendra Modi and President Donald J. Trump.
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Staff Reporter - Mon, 01, Jun 2026
- 05:06 EDT
- 41
Intel Corp. has joined hands 3D Glass Solutions to sign a memorandum of understanding / Courtesy photo
The Government of Odisha, on May 29, announced that California-based American multinational technology company Intel Corp. has joined hands with New Mexico-based 3D Glass Solutions (3DGS) to sign a memorandum of understanding (MoU) for setting up an advanced semiconductor glass-core packaging substrate manufacturing facility in Odisha.
Subject to regulatory approvals, the plan could make this one of the largest technology investments in eastern India and could help position Odisha as a hub for semiconductor manufacturing, advanced packaging, artificial intelligence infrastructure and digital technologies.
The government will back the project in smoothing out regulatory processes, ensure funding support from the state and central governments, and help fulfill other business conditions.
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Talking about the proposal, Indian-origin entrepreneur Babu Mandava, CEO of 3D Glass Solutions, said in a statement, “We are grateful for the strong support of the Government of Odisha and excited about our collaboration with Intel in exploring this opportunity."
He added, "This initiative has the potential to establish India as a key global hub for advanced glass substrates and semiconductor packaging, supporting high-growth sectors such as artificial intelligence, high-performance computing and next-generation electronics.”
Indian American tech executive Naga Chandrasekaran, executive vice president and general manager of Intel Foundry, remarked, “Intel Foundry is proud to collaborate with 3DGS in exploring this opportunity with the Government of Odisha. As a pioneer in glass-core substrate technology, we are excited about the potential of this collaboration to accelerate the commercialization of next-generation advanced packaging solutions globally.”
Among others who expressed excitement over the project was Ambassador of India to the United States Vinay Mohan Kwatra.
Kwatra described the project as an "important milestone in advancing the vision articulated by Prime Minister Narendra Modi and President Donald J. Trump during the prime minister’s visit to Washington, D.C., in February 2025."
Odisha Chief Minister Mohan Charan Majhi said the initiative is about more than semiconductor manufacturing and aims to create opportunities for youth, attract global technology companies, and establish Odisha as a leading destination for advanced technology and innovation.
The state government said the initiative supports Odisha Vision 2036 and India’s Atmanirbhar Bharat mission, with the goal of creating a globally competitive technology ecosystem for future growth.
Odisha Chief Minister Majhi also noted that the initiative is about more than semiconductor manufacturing and aims to create opportunities for youth, attract global technology companies, and establish Odisha as a leading destination for advanced technology and innovation.
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